By Ir. Ts. Dr. Wooi Chin Leong (UniMAP)

The 2024 Annual General Meeting (AGM) of the IEEE (Institute of Electrical and Electronics Engineers) Dielectrics and Electrical Insulation Society (DEIS) Malaysia Chapter was successfully held on 3 February 2024, at Kuala Lumpur Convention Center and Google Meet concurrently. The meeting was attended by 19 active members of IEEE DEIS Malaysia Chapter and chaired by Chapter Chair Assoc. Prof. Ir. Dr. Hazlee.

The meeting began with an opening remark by Assoc. Prof. Ir. Dr. Hazlee, followed by the endorsement of the 2023 AGM minutes and the presentation of the chapter’s activities. Next the treasurer Dr Nik presented account matters. Lastly, a brief planning for the activities in 2024 was discussed.