By Ts. Dr. Wong Jee Keen Raymond (University of Malaya)
In conjunction with the 13th International Conference on the Properties and Applications of Dielectric Materials (ICPADM) held on 12 July 2021, a DEIS membership drive activity was carried out to promote the DEIS membership to the colloquium attendees and to bring awareness to them on the presence of the IEEE DEIS Malaysia Chapter.
The IEEE DEIS Malaysia Chapter was established in Malaysia in May 2015 with the aim to enhance networking and stimulate research and development in the field of dielectrics and electrical insulation in Malaysia. Its field of interest is in line with that of DEIS, i.e., the study and application of dielectric phenomena and behavior and the development, characterization, and application of all gaseous, liquid and solid electrical insulating materials and systems utilized in electrical and electronic equipment.
The IEEE DEIS Malaysia Chapter hopes to promote the close cooperation and exchange of technical information among its members. The IEEE DEIS members will have the opportunity of networking with a large number of experts worldwide, sharing the results of their research activities and remain informed with the latest developments in their field. For more information, please visit:
http://deis.ieeemy.org/ (IEEE DEIS Malaysia Chapter)
http://www.ieeedeis.org/ (IEEE DEIS)